MATERIALS :


Laminate Grade

FR-1, FR-4, CEM-1 & CEM-3 as per Customer’s specific requirements.


Type


 Single-Sided copper-clad with CNC Routing

 CNC Scoring & CNC Drilled Holes or Hard-Tool Pierce

 Blank Punching Double-Sided copper clad with CNC Drilled Plated-through Non-plated-through holes

 Routing

 Scoring & Blanking Multi-layer copper clad with CNC Drilled Plated-through Non-plated-through holes

 Routing & Scoring.



FINISHES :


Soldermask Finishes

Liquid Photo-imageable, thermal-cured or UV-cured soldermasks of green color or as per customer’s required color.


Available Finishes :

 HASL (hot-air solder leveling)

 White Tin Plating

 Immersion Gold Plating

 Electrolytic Nickle & Gold Tab Plating

 Carbon Ink

 Lead Free HASL

 Peelable soldermask & OSP (Organic Solderability Preservative)



Technical Specifications :


 Minimum conductor width    6 mils


 Minimum conductor spacing  6 mils


 Minimum plated hole size   12 mils


 Maximum single-sided board size  24” X 19”


 Maximum double-sided & multi-layer board size 23” X 18”


 Maximum Copper Thickness 4 oz\sq.ft


 SMD Testing  20 mil pitch